Heat Resistance Tape

Category:

Description

Size:10m x width (custom made)
Structure: PI, Acrylic PSA, Paper Liner (FPCB Masking)/ PI, Silicone PSA (General Masking)/ PI, Conductive Silicone PSA, Fluorosilicone Liner (Low Static & Heat Resistance)
Peel Strength: 100gf/in (FPCB  Masking), 600gf/in (General Masking), 550 gf/in (Low Static & Heat Resistance)
Heat Resistance: 240°C x 5 mins (FPCB  Masking), 240°C x 10 mins(General Masking), 240°C x 10 mins (Low Static & Heat Resistance)
Description: No adhesive residue when removing high heat resistant tape, Always excellent workability, used for SMT process, ZiG fixing, both sides, single sided product, gold plated part protection.

Additional information

Size

10m x width (custom made)

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